Thermal
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開始行:
[[Michael Meyer]]
CENTER:SIZE(40){COLOR(green){Survey about Thermal Effects on Photonic NoCs}}
----
-COLOR(red){2016}: Todri-Sanial, Aida, and Chuan Seng Tan, eds., "[[Physical Design for 3D Integrated Circuits>https://books.google.co.jp/books?id=l_UYCwAAQBAJ&pg=PA229&lpg=PA229&dq=thermal+modeling+and+management+for+3d+stacked+systems+tiansheng+zhang&source=bl&ots=TZm68TTozo&sig=aTsQ9Mvm4EMehOupAj3aqywATRM&hl=en&sa=X&ved=0ahUKEwiuhOPY8MbKAhUGLqYKHXKrCUcQ6AEILTAE#v=onepage&q=thermal%20modeling%20and%20management%20for%203d%20stacked%20systems%20tiansheng%20zhang&f=false]], Vol. 55. CRC Press, 2016.
APA
-COLOR(red){2015}: Demir, Y., & Hardavellas, N. (2015, September). Parka: Thermally Insulated Nanophotonic Interconnects. In Proceedings of the 9th International Symposium on Networks-on-Chip (p. 1). ACM.
-COLOR(red){2015}: Buter, W., Huang, Y., Gregorek, D., & Garcia-Ortiz, A. (2015, June). A decentralised, autonomous, and congestion-aware thermal monitoring infrastructure for photonic network-on-chip. In Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC), 2015 10th International Symposium on (pp. 1-8). IEEE.
-COLOR(red){2014}: Yaoyao Ye; Zhehui Wang; Peng Yang; Jiang Xu; Xiaowen Wu; Xuan Wang; Nikdast, M.; Zhe Wang; Duong, L.H.K., "[[System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip>http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=6930846]]," in Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on , vol.33, no.11, pp.1718-1731, Nov. 2014
-COLOR(red){2012}:Qouneh, A., Li, Z., Joshi, M., Zhang, W., Fu, X., & Li, T. (2012, September). Aurora: A thermally resilient photonic network-on-chip architecture. In Computer Design (ICCD), 2012 IEEE 30th International Conference on (pp. 379-386). IEEE.
-COLOR(red){2011}: Zhiliang Qian; Chi-Ying Tsui, "A thermal-aware application specific routing algorithm for Network-on-Chip design," in Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific , vol., no., pp.449-454, 25-28 Jan. 2011
-COLOR(red){2011}:Nitta, C., Farrens, M., & Akella, V. (2011, February). Addressing system-level trimming issues in on-chip nanophotonic networks. In High Performance Computer Architecture (HPCA), 2011 IEEE 17th International Symposium on (pp. 122-131). IEEE.
-COLOR(red){2009}: M.Palesi et.al “Application Specific Routing algorithms for Network on chip” IEEE Transactions on Parellel and Distributed Systems. 20(3), pp. 316-330, 2009
-COLOR(red){2008}:D. W. Kim, A. Barkai, R. Jones, N. Elek, H. Nguyen, and A. S. Liu,“Silicon-on-insulator eight-channel optical multiplexer based on a cascade of asymmetric Mach–Zehnder interferometers,” Opt. Lett., vol. 33, no. 5, pp. 530–532, 2008
-COLOR(red){2009}: Palesi, Maurizio, Shashi Kumar, and Vincenzo Catania. "Bandwidth-aware routing algorithms for networks-on-chip platforms." IET computers & digital techniques 3.5 (2009): 413-429.
-COLOR(red){2007}: R. Amatya, C. W. Holzwarth, F. Gan, H. I. Smith, F. Kartner, R. J. Ram, and M. A. Popovic, "[[Low Power Thermal Tuning of Second- Order Microring Resonators>http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4452439]]," in Conference on Lasers and Electro-Optics/ Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, p.CFQ5 (2007).
-COLOR(red){2007}: Vangal, S.; Singh, A.; Howard, J.; Dighe, S.; Borkar, N.; Alvandpour, A., "A 5.1GHz 0.34mm2 Router for Network-on-Chip Applications," in VLSI Circuits, 2007 IEEE Symposium on , vol., no., pp.42-43, 14-16 June 2007
//---- please do this task later and in another page.
//Please add all Simulation Softwares that are being considered here.
//----
//-http://lava.cs.virginia.edu/HotSpot/
終了行:
[[Michael Meyer]]
CENTER:SIZE(40){COLOR(green){Survey about Thermal Effects on Photonic NoCs}}
----
-COLOR(red){2016}: Todri-Sanial, Aida, and Chuan Seng Tan, eds., "[[Physical Design for 3D Integrated Circuits>https://books.google.co.jp/books?id=l_UYCwAAQBAJ&pg=PA229&lpg=PA229&dq=thermal+modeling+and+management+for+3d+stacked+systems+tiansheng+zhang&source=bl&ots=TZm68TTozo&sig=aTsQ9Mvm4EMehOupAj3aqywATRM&hl=en&sa=X&ved=0ahUKEwiuhOPY8MbKAhUGLqYKHXKrCUcQ6AEILTAE#v=onepage&q=thermal%20modeling%20and%20management%20for%203d%20stacked%20systems%20tiansheng%20zhang&f=false]], Vol. 55. CRC Press, 2016.
APA
-COLOR(red){2015}: Demir, Y., & Hardavellas, N. (2015, September). Parka: Thermally Insulated Nanophotonic Interconnects. In Proceedings of the 9th International Symposium on Networks-on-Chip (p. 1). ACM.
-COLOR(red){2015}: Buter, W., Huang, Y., Gregorek, D., & Garcia-Ortiz, A. (2015, June). A decentralised, autonomous, and congestion-aware thermal monitoring infrastructure for photonic network-on-chip. In Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC), 2015 10th International Symposium on (pp. 1-8). IEEE.
-COLOR(red){2014}: Yaoyao Ye; Zhehui Wang; Peng Yang; Jiang Xu; Xiaowen Wu; Xuan Wang; Nikdast, M.; Zhe Wang; Duong, L.H.K., "[[System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip>http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=6930846]]," in Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on , vol.33, no.11, pp.1718-1731, Nov. 2014
-COLOR(red){2012}:Qouneh, A., Li, Z., Joshi, M., Zhang, W., Fu, X., & Li, T. (2012, September). Aurora: A thermally resilient photonic network-on-chip architecture. In Computer Design (ICCD), 2012 IEEE 30th International Conference on (pp. 379-386). IEEE.
-COLOR(red){2011}: Zhiliang Qian; Chi-Ying Tsui, "A thermal-aware application specific routing algorithm for Network-on-Chip design," in Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific , vol., no., pp.449-454, 25-28 Jan. 2011
-COLOR(red){2011}:Nitta, C., Farrens, M., & Akella, V. (2011, February). Addressing system-level trimming issues in on-chip nanophotonic networks. In High Performance Computer Architecture (HPCA), 2011 IEEE 17th International Symposium on (pp. 122-131). IEEE.
-COLOR(red){2009}: M.Palesi et.al “Application Specific Routing algorithms for Network on chip” IEEE Transactions on Parellel and Distributed Systems. 20(3), pp. 316-330, 2009
-COLOR(red){2008}:D. W. Kim, A. Barkai, R. Jones, N. Elek, H. Nguyen, and A. S. Liu,“Silicon-on-insulator eight-channel optical multiplexer based on a cascade of asymmetric Mach–Zehnder interferometers,” Opt. Lett., vol. 33, no. 5, pp. 530–532, 2008
-COLOR(red){2009}: Palesi, Maurizio, Shashi Kumar, and Vincenzo Catania. "Bandwidth-aware routing algorithms for networks-on-chip platforms." IET computers & digital techniques 3.5 (2009): 413-429.
-COLOR(red){2007}: R. Amatya, C. W. Holzwarth, F. Gan, H. I. Smith, F. Kartner, R. J. Ram, and M. A. Popovic, "[[Low Power Thermal Tuning of Second- Order Microring Resonators>http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4452439]]," in Conference on Lasers and Electro-Optics/ Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, p.CFQ5 (2007).
-COLOR(red){2007}: Vangal, S.; Singh, A.; Howard, J.; Dighe, S.; Borkar, N.; Alvandpour, A., "A 5.1GHz 0.34mm2 Router for Network-on-Chip Applications," in VLSI Circuits, 2007 IEEE Symposium on , vol., no., pp.42-43, 14-16 June 2007
//---- please do this task later and in another page.
//Please add all Simulation Softwares that are being considered here.
//----
//-http://lava.cs.virginia.edu/HotSpot/
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