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開始行:
-[[Members-Internal]]
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CENTER:COLOR(#81111F){SIZE(40){''Thermal-power Aware Mapping Method and Architecture/Design for (Fault-tolerant) 3D-NoC-based Neuromorphic Systems''}}
----
*Background [#d3104867]
(This is still a draft)
Artificial intelligence, neural networks, deep learning, ANNs, SNNs, neuromorphic systems and computing, reduce energy cost and higher bandwith (speed).
Applications:
edge computing (IoT), real time application, devices with limited energy supply.
*Motivation [#w893ae2e]
In the last decade, neural networks and deep learning had improved and gained a lot of interest.
Thermal-aware mapping in neuromorphic computing.
In conventional computers NoC (architecture), thermal awarness researches is advanced but not for neuromorphic HW specially 3D-NoC neuromorphic systems.
Take into concideration the heat generated from neurons' activities in the neuuromorphic hardware and how to make it (spread) equally on the chip.
*Goal [#v20a6f9f]
CENTER:&ref(thermal.png,,60%);
*Research Plan [#bc523092]
***Step 1: [#u6cd39e3]
1- Read and gain knowledge about neuromorphic systems.
2- Guidance tutorials
3- Survey on Routing algorithms for neuromorphic systems.
***Step 2 (doing): [#n00c8de5]
1- Study and document on thermal-power aware mapping and routing for 3D-NoC neuromorphic systems.
2- Propose a thermal-aware mapping method for NASH and implement it.
3- Propose a Thermal Analytical Model for 3D neuromorphic systems.
***Step 3 (doing): [#u6cd39e3]
1- Explore thermal aware methods with other objectives (fault-tolerant, communication cost)
3- Implement methods on FPGA
2- Use implemented method on real life application
*Research Schedule [#r3e361fe]
|Date|Task|
|☑️Oct 1st, 2021 - June 30, 2022|TUTORIALS AND FIELD EXPLORATION : |
|☑️Oct 1st - Dec 31, 2021|Tutorials and reading about neuromorphic systems|
|☑️Jan 1st - May 31, 2022| Survey on Routing methods and algorithms for neuromorphic systems|
|☑️Feb 1st - May 16, 2022| Understand SNPC Source code and do the Tutorials|
|☑️May 18 - June 15, 2022| Documentation on mapping methods for neuromorphic computing|
|☑️June 16- June 27, 2022| Run NASH code for KMCR routing in a 3x3x2 architecture|
|☑️July 1 - Sep 30, 2022| LITTERATURE ON THERMAL POWER IN MCSOC|
|☑️July 15 - July 29, 2022| Run HotCluster source code for benchmarks |
|☑️June 27 - August 12, 2022| Study the thermodynamics in the NASH system using 3D-ICE or HotSpot|
|☑️July 30 - August 12, 2022| Write a paper to summerize HotCluster and make a discussion section about what can be developped based on the existing work for neuromorphic systems|
|☑️Oct 1, 2022 - Feb 28, 2023| ICET CONFERENCE PULICATION WORK|
|☑️Oct 1, 2022 - Jan 31, 2023| develop NASH emulator PyNASH_0.1 for simple power trace extraction and mapping using python|
|☑️Oct 5 - Nov 28, 2022| Model thermal-aware clustering method|
|☑️Nov 28 - Dec 28, 2022| Implement the clustering method TACM, make simulations and test the reults|
|☑️Jan 1 - Feb 20, 2023| Paper writing, proposed method enhancements and running simulations and extracting graphs from the experiments|
|☑️Feb 20 - Feb 24, 2023| submit the paper 'Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems' to ICET conference |
|March 1 - August 31, 2023| JOURNAL PAPER WORK:|
|☑️March 1st - March 12, 2023|Propose the new mapping method based on the previously published method TACM|
|☑️March 13 - March 31, 2023|Sick leave (Appendicitis surgery)|
|☑️April 1 - April 15, 2023| Write the Spiking Neural Network training script and spikes trains extraction|
|☑️April 15 - April 30, 2023| Implement the draft version of the proposed mapping method and test it|
|☑️May 1 - May 30, 2023| Try to implement the mapping results on nash to get latency and accuracy but failed|
|☑️June 1st - June 30, 2023| Start writing the Journal draft improving the PyNASH emulator for faster simulations|
|☑️July 1st - July 31, 2023| GA-TACM mapping method implementation and thermal simulation using different parameters|
|☑️August 1st - August 7, 2023| 2nd journal draft with new simulation results for 3x3x3 NooC NASH|
|☑️August 7st - August 16, 2023| algorithm modifications for proposed cluster based order crossover and mutation and rerun thermal simulation|
|☑️August 17st - September 15, 2023| update draft journal|
|☑️Sept 15 - Dec 20, 2023| Propose BTSAM and start working on journal|
|☑️Jan 10 - Apr 17 2024|Write and submit Journal BTSAM: Balanced Thermal-State-Aware Mapping Algorithms and Architecture for 3D-NoC-Based Neuromorphic Systems|
|☑️Apr 8 - Apr 30, 2024| Build new case study in the change of temperature due to migration after faults occur |
|☑️Mai 10 - June 11, 2024| Address BTSAM paper reviews, update manuscript, and resubmit|
|June 11 - June 30, 2024| Implement the thermal aware mapping in NASH NI |
|July 1 - July 10, 2024| Propose Multi-objective thermal aware fault tolerant remapping method with small simulation results |
|July 11 - August 31, 2024| Draft and submit Thesis for preliminary review |
|July 11 - July 31, 2024| conduct experiments and simulations for the study case with the proposed Multi-Objective Optimization (MOO) method on software|
|August 1 - August 7, 2024| Build hardware simulation script for the case study of thermal issue with fault tolerance |
|August 8 - August 11, 2024|Work on the thermal analytical model to introduce the communication energy in the model|
|August 12 - August 15, 2024| Implement and draft Journal|
|August 15 - August 31, 2024|Write the full Journal including experiments and results|
|Sep 1 - Sep 5, 2024|Revise and submit Journal|
*Achievements [#g0c8f9db]
***Under Review or Accepted Journal Papers [#p4f63a6e]
- Mohamed Maatar, Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah "BTSAM: Balanced Thermal-State-Aware Mapping Algorithms and Architecture for 3D-NoC-Based Neuromorphic Systems", IEEE Access (under review)
--Submitted version to IEEE Access (June, 11 2024) &ref(BTSAM.pdf);
--Submitted Revised Version &ref(https://adaptive.u-aizu.ac.jp/aslint/index.php?plugin=attach&pcmd=open&file=NASH_Thermal_2024_06_09.pdf&refer=Md%20Maatar);
***Accepted Conference Papers [#yc693d3d]
-Mohamed Maatar, Khanh N. Dang, Abderazek Ben Abdallah "Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems", 2023 6th International Conference on Electronics Technology (ICET)
--Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems (04/15/2023, Time:8:04 AM) &ref(Maatar_ICET_2023_final.pdf);
--Presentation slide (5/20/2023, Time:2:00 PM) &ref(Maatar_ICET23_Final_Slides.pptx);
-Mohamed Maatar, Khanh N. Dang, Abderazek Ben Abdallah "Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System", 2024 IEEE International Conference on Advanced Systems and Emergent Technologies (IC_ASET'2024)
--Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System (03/13/2024, 17:00) &ref(CBGATAM.pdf);
CENTER:Schedule Updated on June, 11 2024
*My Shared GDrive [#pa27546c]
-[[My-Shared-GoogleDrive>https://drive.google.com/drive/folders/13y-JI0IsITfOUwLhmHe-l8XculMqY4ot?usp=sharing]]
-[[Ebooks>https://drive.google.com/drive/folders/1t0ewhEhe4Oa9AaTPKdmUfJib0a37JEdD?usp=sharing]]
***Key references [#za60ab62]
-“Mass transport of aluminum by momentum exchange with conducting electrons,” in 6th Annual Reliability Physics Symposium (IEEE), 1967.
-“Temperature-aware routing in 3D ICs,” in Asia and South Pacific Conf. on Design Automation, 2006.
-“Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization,” Applied Soft Computing, 2015.
-“Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements,” IEEE Circuits Syst. Mag., 2015.
-“Thermal-aware application mapping strategy for network-on-chip based system design.” IEEE Transactions on Computers 2017
-“Thermal-aware IP virtualization and placement for networks-on-chip architecture.” IEEE International Conference on Computer Design 2004
-“Thermal-aware mapping and placement for 3-D NoC designs." Proceedings 2005 IEEE International SOC Conference
-“HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022.
-“Migspike: A migration based algorithms and architecture for scalable robust neuromorphic systems”, IEEE Transactions on Emerging Topics in Computing (2021)
終了行:
-[[Members-Internal]]
----
CENTER:COLOR(#81111F){SIZE(40){''Thermal-power Aware Mapping Method and Architecture/Design for (Fault-tolerant) 3D-NoC-based Neuromorphic Systems''}}
----
*Background [#d3104867]
(This is still a draft)
Artificial intelligence, neural networks, deep learning, ANNs, SNNs, neuromorphic systems and computing, reduce energy cost and higher bandwith (speed).
Applications:
edge computing (IoT), real time application, devices with limited energy supply.
*Motivation [#w893ae2e]
In the last decade, neural networks and deep learning had improved and gained a lot of interest.
Thermal-aware mapping in neuromorphic computing.
In conventional computers NoC (architecture), thermal awarness researches is advanced but not for neuromorphic HW specially 3D-NoC neuromorphic systems.
Take into concideration the heat generated from neurons' activities in the neuuromorphic hardware and how to make it (spread) equally on the chip.
*Goal [#v20a6f9f]
CENTER:&ref(thermal.png,,60%);
*Research Plan [#bc523092]
***Step 1: [#u6cd39e3]
1- Read and gain knowledge about neuromorphic systems.
2- Guidance tutorials
3- Survey on Routing algorithms for neuromorphic systems.
***Step 2 (doing): [#n00c8de5]
1- Study and document on thermal-power aware mapping and routing for 3D-NoC neuromorphic systems.
2- Propose a thermal-aware mapping method for NASH and implement it.
3- Propose a Thermal Analytical Model for 3D neuromorphic systems.
***Step 3 (doing): [#u6cd39e3]
1- Explore thermal aware methods with other objectives (fault-tolerant, communication cost)
3- Implement methods on FPGA
2- Use implemented method on real life application
*Research Schedule [#r3e361fe]
|Date|Task|
|☑️Oct 1st, 2021 - June 30, 2022|TUTORIALS AND FIELD EXPLORATION : |
|☑️Oct 1st - Dec 31, 2021|Tutorials and reading about neuromorphic systems|
|☑️Jan 1st - May 31, 2022| Survey on Routing methods and algorithms for neuromorphic systems|
|☑️Feb 1st - May 16, 2022| Understand SNPC Source code and do the Tutorials|
|☑️May 18 - June 15, 2022| Documentation on mapping methods for neuromorphic computing|
|☑️June 16- June 27, 2022| Run NASH code for KMCR routing in a 3x3x2 architecture|
|☑️July 1 - Sep 30, 2022| LITTERATURE ON THERMAL POWER IN MCSOC|
|☑️July 15 - July 29, 2022| Run HotCluster source code for benchmarks |
|☑️June 27 - August 12, 2022| Study the thermodynamics in the NASH system using 3D-ICE or HotSpot|
|☑️July 30 - August 12, 2022| Write a paper to summerize HotCluster and make a discussion section about what can be developped based on the existing work for neuromorphic systems|
|☑️Oct 1, 2022 - Feb 28, 2023| ICET CONFERENCE PULICATION WORK|
|☑️Oct 1, 2022 - Jan 31, 2023| develop NASH emulator PyNASH_0.1 for simple power trace extraction and mapping using python|
|☑️Oct 5 - Nov 28, 2022| Model thermal-aware clustering method|
|☑️Nov 28 - Dec 28, 2022| Implement the clustering method TACM, make simulations and test the reults|
|☑️Jan 1 - Feb 20, 2023| Paper writing, proposed method enhancements and running simulations and extracting graphs from the experiments|
|☑️Feb 20 - Feb 24, 2023| submit the paper 'Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems' to ICET conference |
|March 1 - August 31, 2023| JOURNAL PAPER WORK:|
|☑️March 1st - March 12, 2023|Propose the new mapping method based on the previously published method TACM|
|☑️March 13 - March 31, 2023|Sick leave (Appendicitis surgery)|
|☑️April 1 - April 15, 2023| Write the Spiking Neural Network training script and spikes trains extraction|
|☑️April 15 - April 30, 2023| Implement the draft version of the proposed mapping method and test it|
|☑️May 1 - May 30, 2023| Try to implement the mapping results on nash to get latency and accuracy but failed|
|☑️June 1st - June 30, 2023| Start writing the Journal draft improving the PyNASH emulator for faster simulations|
|☑️July 1st - July 31, 2023| GA-TACM mapping method implementation and thermal simulation using different parameters|
|☑️August 1st - August 7, 2023| 2nd journal draft with new simulation results for 3x3x3 NooC NASH|
|☑️August 7st - August 16, 2023| algorithm modifications for proposed cluster based order crossover and mutation and rerun thermal simulation|
|☑️August 17st - September 15, 2023| update draft journal|
|☑️Sept 15 - Dec 20, 2023| Propose BTSAM and start working on journal|
|☑️Jan 10 - Apr 17 2024|Write and submit Journal BTSAM: Balanced Thermal-State-Aware Mapping Algorithms and Architecture for 3D-NoC-Based Neuromorphic Systems|
|☑️Apr 8 - Apr 30, 2024| Build new case study in the change of temperature due to migration after faults occur |
|☑️Mai 10 - June 11, 2024| Address BTSAM paper reviews, update manuscript, and resubmit|
|June 11 - June 30, 2024| Implement the thermal aware mapping in NASH NI |
|July 1 - July 10, 2024| Propose Multi-objective thermal aware fault tolerant remapping method with small simulation results |
|July 11 - August 31, 2024| Draft and submit Thesis for preliminary review |
|July 11 - July 31, 2024| conduct experiments and simulations for the study case with the proposed Multi-Objective Optimization (MOO) method on software|
|August 1 - August 7, 2024| Build hardware simulation script for the case study of thermal issue with fault tolerance |
|August 8 - August 11, 2024|Work on the thermal analytical model to introduce the communication energy in the model|
|August 12 - August 15, 2024| Implement and draft Journal|
|August 15 - August 31, 2024|Write the full Journal including experiments and results|
|Sep 1 - Sep 5, 2024|Revise and submit Journal|
*Achievements [#g0c8f9db]
***Under Review or Accepted Journal Papers [#p4f63a6e]
- Mohamed Maatar, Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah "BTSAM: Balanced Thermal-State-Aware Mapping Algorithms and Architecture for 3D-NoC-Based Neuromorphic Systems", IEEE Access (under review)
--Submitted version to IEEE Access (June, 11 2024) &ref(BTSAM.pdf);
--Submitted Revised Version &ref(https://adaptive.u-aizu.ac.jp/aslint/index.php?plugin=attach&pcmd=open&file=NASH_Thermal_2024_06_09.pdf&refer=Md%20Maatar);
***Accepted Conference Papers [#yc693d3d]
-Mohamed Maatar, Khanh N. Dang, Abderazek Ben Abdallah "Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems", 2023 6th International Conference on Electronics Technology (ICET)
--Thermal-Aware Task-Mapping Method for 3D-NoC-Based Neuromorphic Systems (04/15/2023, Time:8:04 AM) &ref(Maatar_ICET_2023_final.pdf);
--Presentation slide (5/20/2023, Time:2:00 PM) &ref(Maatar_ICET23_Final_Slides.pptx);
-Mohamed Maatar, Khanh N. Dang, Abderazek Ben Abdallah "Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System", 2024 IEEE International Conference on Advanced Systems and Emergent Technologies (IC_ASET'2024)
--Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System (03/13/2024, 17:00) &ref(CBGATAM.pdf);
CENTER:Schedule Updated on June, 11 2024
*My Shared GDrive [#pa27546c]
-[[My-Shared-GoogleDrive>https://drive.google.com/drive/folders/13y-JI0IsITfOUwLhmHe-l8XculMqY4ot?usp=sharing]]
-[[Ebooks>https://drive.google.com/drive/folders/1t0ewhEhe4Oa9AaTPKdmUfJib0a37JEdD?usp=sharing]]
***Key references [#za60ab62]
-“Mass transport of aluminum by momentum exchange with conducting electrons,” in 6th Annual Reliability Physics Symposium (IEEE), 1967.
-“Temperature-aware routing in 3D ICs,” in Asia and South Pacific Conf. on Design Automation, 2006.
-“Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization,” Applied Soft Computing, 2015.
-“Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements,” IEEE Circuits Syst. Mag., 2015.
-“Thermal-aware application mapping strategy for network-on-chip based system design.” IEEE Transactions on Computers 2017
-“Thermal-aware IP virtualization and placement for networks-on-chip architecture.” IEEE International Conference on Computer Design 2004
-“Thermal-aware mapping and placement for 3-D NoC designs." Proceedings 2005 IEEE International SOC Conference
-“HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2022.
-“Migspike: A migration based algorithms and architecture for scalable robust neuromorphic systems”, IEEE Transactions on Emerging Topics in Computing (2021)
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