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[[<<--Back to VLSI@ASL>http://adaptive.u-aizu.ac.jp/aslint/index.php?VLSI-Design]] ***Photonic Simulators and Tools [#kc96ab29] -[[Interactive FDTD-Toolbox for Matlab>http://www.problemsinelectrodynamics.com/tools]] --[[Light Propagation in a Photonic Crystal - iFDTD Tutorial>http://www.problemsinelectrodynamics.com/tools/interactive-fdtd-toolbox/ifdtd-photonic-crystal]] ***Benchmarks [#i3766717] -http://aslweb.u-aizu.ac.jp/aslint/index.php?Tools -[[SPEC (The Standard Performance Evaluation Corporation)>http://www.specbench.org/]] -[[All SPEC CPU2006 Results Published by SPEC>http://www.spec.org/cpu2006/results/cpu2006.html]] -[[LMbench - Tools for Performance Analysis>http://www.netlib.org/linpack/]] -[[BYTE UNIX Benchmarks>http://code.google.com/p/byte-unixbench/]] -[[The Benchmark Gateway from IDEAS International>http://www.ideasinternational.com/benchmark/bench.html]] ***Conferences/ORG [#n7fa5b7f] -MCSoC: http://www.mcsoc-forum.org/ -D43D: http://www.d43d.com -NoCs: http://www.nocsymposium.org -MPSoC: http://www.mpsoc-forum.org/ -LETI: http://www.leti-innovationdays.com/ -JEDAT: http://www.jedat.co.jp/eng/company/overview.html - [[Silicon Photonics Cluster: Cluster of European silicon photonics R&D projects>http://www.siliconphotonics.eu/]] - [[HELIOS: EU funded silicon photonics integrated project>http://www.helios-project.eu/]] - [[ePIXfab: The silicon photonics platform - running multiproject wafer shuttle runs>http://www.epixfab.eu/]] -[[ChipDesign>http://chipdesignmag.com/cadence/]] ***Miscellaneous [#f42cd47f] -[[Research Committee for 3D Integration by Low-temperature Bonding Technology>http://www.su.t.u-tokyo.ac.jp/~3dwb/committee/index-e.html]] -[[IEEE CPMT (Components, Packaging and Manufacturing Technology) Society Japan Chapter Society>http://www.cpmt.org/]] -[[IEEE Japan Council>http://www.ieee-jp.org/japancouncil/index_e.htm]] -[[Japan Institute of Electronics Packaging (JIEP)>http://www.e-jisso.jp/]] -[[IMAPS>http://www.imaps.org/]] -http://techventure.rti.org/ -http://www.wadimos.eu/index.php?id=22 -http://www.zy-cube.com/ On-line Lectures: -[[Advanced Packaging in iPhone>https://www.youtube.com/watch?v=dR9Nq2sN8ac]] -[[2.5 D & 3D Chips: Interposers and Through Silicon Vias>https://www.youtube.com/watch?v=L7ojK4U67Ik]]
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[[<<--Back to VLSI@ASL>http://adaptive.u-aizu.ac.jp/aslint/index.php?VLSI-Design]] ***Photonic Simulators and Tools [#kc96ab29] -[[Interactive FDTD-Toolbox for Matlab>http://www.problemsinelectrodynamics.com/tools]] --[[Light Propagation in a Photonic Crystal - iFDTD Tutorial>http://www.problemsinelectrodynamics.com/tools/interactive-fdtd-toolbox/ifdtd-photonic-crystal]] ***Benchmarks [#i3766717] -http://aslweb.u-aizu.ac.jp/aslint/index.php?Tools -[[SPEC (The Standard Performance Evaluation Corporation)>http://www.specbench.org/]] -[[All SPEC CPU2006 Results Published by SPEC>http://www.spec.org/cpu2006/results/cpu2006.html]] -[[LMbench - Tools for Performance Analysis>http://www.netlib.org/linpack/]] -[[BYTE UNIX Benchmarks>http://code.google.com/p/byte-unixbench/]] -[[The Benchmark Gateway from IDEAS International>http://www.ideasinternational.com/benchmark/bench.html]] ***Conferences/ORG [#n7fa5b7f] -MCSoC: http://www.mcsoc-forum.org/ -D43D: http://www.d43d.com -NoCs: http://www.nocsymposium.org -MPSoC: http://www.mpsoc-forum.org/ -LETI: http://www.leti-innovationdays.com/ -JEDAT: http://www.jedat.co.jp/eng/company/overview.html - [[Silicon Photonics Cluster: Cluster of European silicon photonics R&D projects>http://www.siliconphotonics.eu/]] - [[HELIOS: EU funded silicon photonics integrated project>http://www.helios-project.eu/]] - [[ePIXfab: The silicon photonics platform - running multiproject wafer shuttle runs>http://www.epixfab.eu/]] -[[ChipDesign>http://chipdesignmag.com/cadence/]] ***Miscellaneous [#f42cd47f] -[[Research Committee for 3D Integration by Low-temperature Bonding Technology>http://www.su.t.u-tokyo.ac.jp/~3dwb/committee/index-e.html]] -[[IEEE CPMT (Components, Packaging and Manufacturing Technology) Society Japan Chapter Society>http://www.cpmt.org/]] -[[IEEE Japan Council>http://www.ieee-jp.org/japancouncil/index_e.htm]] -[[Japan Institute of Electronics Packaging (JIEP)>http://www.e-jisso.jp/]] -[[IMAPS>http://www.imaps.org/]] -http://techventure.rti.org/ -http://www.wadimos.eu/index.php?id=22 -http://www.zy-cube.com/ On-line Lectures: -[[Advanced Packaging in iPhone>https://www.youtube.com/watch?v=dR9Nq2sN8ac]] -[[2.5 D & 3D Chips: Interposers and Through Silicon Vias>https://www.youtube.com/watch?v=L7ojK4U67Ik]]
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