Design and Evaluation of 3D OASIS Router with Through-Silicon-Via (TSV)

Background (Problem Definition)

During this last decade, 3D- Network-on-Chips (3D-NoCs) have been proposed as a promising solution for future systems on chip design. It offers more scalability, higher bandwidth, and less interconnect-power than the 2D-NoC architectures.

One of the major issues in 3D-NoC systems is how to verify the system correctness and integrity. 3D-NoC architecture research include a lot of trade-offs between topology, routing, flow control, buffer size, packet size, and other optimization techniques. It is difficult to analyze these trade-offs using only high-level simulations. Therefore, prototyping is an essential design phase for evaluating the performance of NoC architecture under real applications.

Previously, 3D-OASIS- NoC (3D-ONoC) has been designed. 3D-FTO showed great performance under real benchmarks and synthetic traffic patterns [1]. However, logic modules were connected to routers instead of real cores. This make the evaluation less accurate.

Research goal

The main goals of this research are:

Design & Simulation Approach

OASIS-Router-Design-Steps.jpg
Fig.1 Design & Simulation Approach

Research Plan

Step 1 Due date: July 20, August 10, 2015 [#ebd0f702]

Step 2 Due date: August 30, 2015

Step 3 Due date: October 21, 2015

Step 4 Due date: December 20, 2015

Step 5 Writing period: December 2015 - January 2016.

References

Verilog Code


Updates:


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