Special Seminar
Every Wednesday,1th period

Regulation

AY 2015 Q1 and Q2 Schedule

DatePresenterPaper2 PAGES Report (Download Report Template)
5/13MikeThree-dimensional Integration Technology
5/20Achraf
5/27KhanhAnalytical Reliability Analysis of 3D NoC under TSV Failure, ACM Journal on Emerging Technologies in Computing Systems (JETC),2015.
6/10MikeMETEOR: Hybrid photonic ring-mesh network-on-chip for multicore architectures, ACM Transactions on Embedded Computing Systems (TECS), 2014 PAGE 1 to 14
6/17AchrafMETEOR: Hybrid photonic ring-mesh network-on-chip for multicore architectures, ACM TECS 2014, PAGE 15 to END
6/24Khan
7/1Mike
7/8Achraf
7/15Khan
7/29Mike

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