Project Overview

The huge computing power of multi-processor systems would require very large on-chip and off-chip data transfer rates (> 100TB/s). One efficient technology for transmitting this level of information is the photonics interconnects, which promise significant advantages over their electronic counterparts. In particular, nanophotonics (light on the nanometer scale on nanometer-scale devices) on-chip interconnects offer a potentially disruptive technology solution with fundamentally low power dissipation, ultra-high bandwidth and low latency. In addition, when combined with 3D integration technology, photonics interconnect offers advantages over electronic 2D NoC design, such as shorter wire length, higher packing density, and smaller footprint. From another hand, to ensure that these complex systems are able to accommodate faults and maintain operation, there is a needs for the development of an efficient mechanisms that can self-detect, self-diagnosis and self-recover in the processing cores as well as in the on-chip interconnects (NoC). The goal of this project is to study new reliable optical interconnect solutions to improve energy efficiency and data bandwidth of on-chip interconnects for embedded and high-performance many-core systems.

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PHENIC Architecture
PHENIC 3D Animation: 8x8 with four Photonics Layers; 8x8 with Single Photonics Layer

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