| Date | Presenter | Paper | Report (Download Report Template) |
| 5/13 | Mike | Three-dimensional Integration Technology | |
| 5/20 | Achraf | ||
| 5/27 | Khanh | Analytical Reliability Analysis of 3D NoC under TSV Failure, ACM Journal on Emerging Technologies in Computing Systems (JETC),2015. | |
| 6/10 | Mike | ||
| 6/17 | Achraf | ||
| 6/24 | Khan | ||
| 7/1 | Mike | ||
| 7/8 | Achraf | ||
| 7/15 | Khan | ||
| 7/29 | Mike |