OASIS: Reliable Network-on-Chip Project

Project Description:

Future embedded and general purpose processor architectures will be implemented as multicore systems with nanoscale technology consisting of hundreds of processing and storage elements. These multicore systems are emerging as a key design solution for today's nanoelectronics design problems. The interconnection structure supporting such systems will be closer to a sophisticated network than to current bus-based solutions. Such network must provide high throughput and low latency while keeping area and power consumption low.

Our research efforts is about solving several design challenges to enable such new paradigm in Multicore Systems. In particular, we are investigating implementation techniques for basic building blocks, new topologies, flow control techniques, and low-latency, high-throughput/fault-tolerant routing algorithms.

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Members

Former Members:

Group Publications

Theses:

Technical Reports and Tutorials

Verilog Code

Benchmark suite

References:

TSV

1.(2014) TSV-to-TSV Inductive Coupling-Aware Coding Scheme for 3D Network-on-Chip, Ashkan Eghbal, Pooria M.Yaghini, Siavash S.Yazdi, and Nader Bagherzadeh Department of Electrical Engineering and Computer Science, University of California, Irvine.

2. (2013) A Low-overhead Fault Tolerance Scheme for TSV-based 3D Network on Chip Links, Igor Loi, , Subhasish Mitra,Thomas H. Lee, Shinobu Fujita, and Luca Benini, DEIS, University of Bologna, Bologna, Italy,Stanford University, California, Usa,Toshiba, San Jose, CA, USA (Kawasaki, Kanagawa, Japan)

3. Session 8: Emerging Technologies, Local copy.


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